OUTLINE DIMENSIONS
7.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
0.60 MAX
0.60 MAX
37
36
0.30
0.23
0.18
48
1
6.75
BSC SQ
EXPOSED
PAD
(BOTTOM VIEW)
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.50
0.40
25
12
0.30
24
13
0.80 MAX
0.65 TYP
0.50 BSC
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
5.50
REF
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
Figure 52. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
(CP-48-3)
Dimensions shown in millimeters
PIN 1
INDICATOR
4.25
4.10 SQ
3.95
0.25 MIN
ADF7025
ORDERING GUIDE
Model
ADF7025BCPZ1
ADF7025BCPZ-RL1
ADF7025BCPZ-RL71
EVAL-ADF70XXMB
EVAL-ADF70XXMB2
EVAL-ADF7025DB1
1 Z = Pb-free part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Control Mother Board
Evaluation Platform
902–928 MHz Daughter Board
Package Option
CP-48-3
CP-48-3
CP-48-3
Rev. A | Page 41 of 44