GL5ZR302BOS View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
'GL5ZR302BOS' PDF : 11 Pages View PDF
DG996031
MODEL No.
JunA6/99 1
PAGE
7. Pnxautions for use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-2-l installation on a P W B
Vhen mounting an LEDlamp on a PIB,do not apply
physical stress to the lead pins.
l The lead pin pitch should match the PIB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l Ihen positioning an LEDlamp,basically employ
an LEDwith tie-bar cut or use a spacer.
7-2-2 Whenan LED1 is mounted directly on a P W B ’
If the bottom face of an LED lamp is mounted
directly on single-sided PW,the base of the
lead pins maybe subjected to physical stress
due to PYBwarp,cutting or clinching of lead
pins.Prior to use,be sure to check that no
disconnection inside of the resin or damageto
resin etc.,is found-Then an LED lamp is mounted
on a double-sided PWB,theheat during soldering
affects the resin;therefore.keep the LED lamp
more that l.6mm afloat above the PWB.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-Z-4 Installation to the-case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
NG
Good
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. 611
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