GL5ZR302BOS View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
'GL5ZR302BOS' PDF : 11 Pages View PDF
DG99603 1
MODEL No.
GL5ZR302BOS
JLud16/9!I
PAGE
5110
4. Reliability
The reliability of productsshallbesatisfiedwith itemslistedbelow.
LCl. Test itemsandtestconditions
Test items
Test conditions
Solderability
Soldering
temperature
Mechanical shock
Variable frequency
vibration
Terminal strength
(Tension)
Terminal strength
(Bending)
230t5”C, 5s
Prior disposition: Dip in rosin flux
260f5”C; 5s
15OOOm/sz0,5ms,
3timesI 33SYptZ direction
2OOm/s*1, 00to 2 000 to lOOHz/sweepfor 4min.
,4times/S&Y&Z direction
Weight: ION, S/each terminal
Weight:SN,O” + 90” --) O”* -90” + 0”
/each terminal
Temperaturecycling 40~(3Omin)~+100”c(3Omin),30 cycles
High temp.andhigh
humidity storage
Ta=+60”C, 9O%RH,t=lOOOh
I!Iigh temperaturestorageTa=lOO”C,t=lOOOh
Low temperaturestorageTa=4O”c, t=lOOOh
Operationlife Ta=25”c, IFMAX. t=lOOOh*3
Confidencelevel: 90’
Samples(n) LTPC
Defective (C) @IO)
n=ll, C=O 20
n=ll, C=O 20
n=ll, C=O 20
n=ll.C=O
20
n=ll,C=O
20
n=ll, C=O 20
n=22, C=O 10
n=22. C=O 10
n=22, C=O 10
n=22, C=O 10
n=22, C=O 10
4-2. MeasurementitemsandFailurejudgementcriteria * 1
Measurement
Symbol
Failurejudgementcriteria *2
Forward voltage
vF
VF > U.S.L. x 1.2
Reversecurrent
IR
IR> U.S.L. x 2.0
Luminousintensity
Iv
Iv > The first stagevalueX 2.0 or The first stagevalueX 0.5 > Iv
s Solderability : Soldershallbe adhereat theareaof 95% or moreof dippedpotion.
g Terminal strength: Packageis not destroyed,andterminal is not slack.
* 1: Measuringconditionis in accordancewith specification.
*2: U.S.L. is shownby UpperSpecificationLimit.
*3: IFMAXis shownby forward current of absolutemaximumratings.
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