HCTL-2021 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'HCTL-2021' PDF : 12 Pages View PDF
1 D0
VDD 16
2 CLK
D1 15
3 SEL
D2 14
4 OE
D3 13
5 RST
D4 12
6 CH B
D5 11
7 CH A
D6 10
8 VSS
D7 9
PINOUT A
1 D0
VDD 20
2 CLK
D1 19
3 SEL
D2 18
4 OE
D3 17
5 U/D CNTdec 16
6 NC CNTcas 15
7 RST
D4 14
8 CH B
D5 13
9 CH A
D6 12
10 VSS
D7 11
PINOUT B
Soldering and Mounting Considerations
It is recommended to use manual soldering for HCTL-
2021/2017 launch pad devices due to the characteristics
of the material used in the launch pad design that not
allow wave soldering.
Direct mounting on printed circuit board (PCB) only is
recommended for HCTL-2021/2017 launch pad devices.
Mounting gap of 1mm between the base of the launch
pad and customer’s printed circuit board (PCB) is
required.
NOTE: Precaution is required in order to avoid bend or loose pin
during product handling.
Package Dimensions with Tolerances
HCTL-2017
HCTL-2021
Length (L)
22.86 ± 0.5 mm
27.94 ± 0.5 mm
(dimension in mm)
Width (W)
12.70 ± 0.5 mm
12.70 ± 0.5 mm
Thickness (T)
1.67 ± 0.25 mm
1.67 ± 0.25 mm
HCTL-2021 SHOWN
2
PIN DRAWING
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