HFBR-2402C View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
MFG CO.
HFBR-2402C
HP => Agilent Technologies
'HFBR-2402C' PDF : 31 Pages View PDF
Reliability Information
Low Cost Miniature Link
components with the Conductive
Port Option are as reliable as
standard HFBR-0400
components. The following tests
were performed to verify the
mechanical reliability of this
option.
Ordering Information
To order the Conductive Port
Option with a particular receiver
component, place a “C” after the
base part number. For example,
to order an HFBR-2406 with this
option, order an HFBR-2406C. As
another example, to order an
HFBR-2416T with this option,
order an HFBR-2416TC.
This option is available with the
following part numbers:
HFBR-2402
HFBR-2404
HFBR-2406
HFBR-2412T
HFBR-2414T
HFBR-2416T
HFBR-2432
HFBR-2434
HFBR-2436
HFBR-2442T
HFBR-2444T
HFBR-2446T
HFBR-2452
HFBR-2454
HFBR-2456
HFBR-2462T
HFBR-2464T
HFBR-2466T
Mechanical and Environmental Tests [1]
MIL-STD-883/
Other
Test
Reference
Test Conditions
Temperature Cycling
1010
Condition B
-55°C to +125°C
15 min. dwell/5 min. transfer
100 cycles
Thermal Shock
1011
Condition B
-55°C to +125°C
5 min. dwell/10 sec. transfer
500 cycles
High temp. Storage
1008
Condition B
TA = 125°C
1000 hours
Mechanical Shock
2002
Condition B
1500 g/0.5 ms
5 impacts each axis
Port[2] Strength
Seal Dye Penetrant
(Zyglo)
TA = 25°C
1014
Condition D
6 Kg-cm no port damage
45 psi, 10 hours
No leakage into microelectronic cavity
Solderability
2003
245°C
Resistance to
Solvents
2015
3 one min. immersion brush
after solvent
Chemical Resistance
-
5 minutes in Acetone, Methanol,
Boiling Water
Temperature-
Humidity
-
TA = 85°C, RH = 85%
Biased, 500 hours
Lead Integrity
2004
Condition B2
8 oz. wt. to each lead tested for
three 90° arcs of the case
Electrostatic
Discharge (ESD)
IEC-801-2
Direct contact discharge to port,
0-15 kV [3]
Units
Tested
70
Total
Failed
0
45
0
50
0
40
0
20
0
15
0
10
0
13`
0
12
0
30
0
16
0
16
0
Notes:
1. Tests were performed on both SMA an ST products with the conductive port option.
2. The Port Strength test was designed to address the concerns with hand tightening the SMA connector to the fiber optic port. The limit
is set to a level beyond most reasonable hand fastening loading.
3. HP has previously used an air discharge method to measure ESD; results using this method vary with air temperature and humidity.
The direct contact discharge method is perferred due to better repeatability and conformance with IEC procedures. ESD immunity
measured with the air discharge method is generally higher than with the direct contact discharge method.
72
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