Appendix A: HSDL-3602-007/-037 SMT Assembly Application Note
1.0. Solder Pad, Mask, and Metal Solder Stencil Aperture
STENCIL
APERTURE
METAL STENCIL
FOR SOLDER PASTE
PRINTING
LAND PATTERN
SOLDER
MASK
PCBA
Figure 1. Stencil and PCBA.
HSDL-3602 fig 1.0
1.1. Recommended Land Pattern for HSDL-3602-007/-037
Dim.
a
b
c (pitch)
d
e
f
g
mm
2.40
0.70
1.10
2.35
2.80
3.13
4.31
inches
0.095
0.028
0.043
0.093
0.110
0.123
0.170
SHIELD SOLDER PAD
e
d
Rx LENS
b
Y
theta
a
g
Tx LENS
f
X
h
FIDUCIAL
10x PAD
Figure 2. Top view of land pattern.
c
FIDUCIAL
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