HSDL-3602-037 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'HSDL-3602-037' PDF : 27 Pages View PDF
2.0. Recommended solder paste/cream volume for castel-
lation joints
Based on calculation and experiment, the printed sol-
der paste volume required per castellation pad is 0.30
cubic mm (based on either no-clean or aqueous solder
cream types with typically 60 to 65% solid content by
volume).
2.1. Recommended Metal Solder Stencil Aperture
It is recommended that only 0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. The following combina-
tion of metal stencil aperture and metal stencil thick-
ness should be used:
See Figure 4
t, nominal stencil thickness
l, length of aperture
mm
inches
mm
inches
0.152
0.006
2.8 ± 0.05
0.110 ± 0.002
0.127
0.005
3.4 ± 0.05
0.134 ± 0.002
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimension.
APERTURE AS PER
LAND
t (STENCIL THICKNESS)
SOLDER
PASTE
w
l
Figure 4. Solder paste stencil aperture.
3.0. Pick and Place Misalignment THoSlDeLr-a3n60c2efaign4d.0Product
Self-Alignment after Solder Reflow
If the printed solder paste volume is adequate, the
unit will self-align in the X-direction after solder reflow.
Units should be properly reflowed in IR Hot Air convec-
tion oven using the recommended reflow profile. The
direction of board travel does not matter.
Allowable Misalignment Tolerance
X-direction
≤ 0.2 mm (0.008 inches)
Theta-direction
± 2 degrees
16
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