HSDL-7002 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'HSDL-7002' PDF : 11 Pages View PDF
HSDL-7002 Moisture Proof Packaging
All HSDL-7002 options are shipped in moisture proof pack-
age. Once opened, moisture absorption begins.
This part is compliant to JEDEC MSL (Moisture Sensetive
Level ) 3.
Baking Conditions
If the parts are not stored in dry conditions, they must be
baked before reflow to prevent damage to the parts.
Recommended Storage Conditions
Storage Temperature 10°C to 30°C
Relative Humidity
below 60% RH
Time from unsealing to soldering
After removal from the bag, the parts should be soldered
within three days if stored at the recommended storage
conditions. If times longer than three days are needed,
the parts must be stored in a dry box.
Package
In reels
In bulk
Temp
60 °C
100 °C
125 °C
150 °C
Baking should only be done once.
Time
≥ 48hours
≥ 4hours
≥ 2 hours
≥ 1 hour
Units in A
Sealed
Moisture-Proof
Package
Package Is
Opened
(Unsealed)
No
Yes
Baking Is
Necessary
Figure 4. Baking Conditions Chart
Environment
less than 25 deg C,
and less than
60% RH
Yes
Package Is
Opened for less
than 168
hours
No
Perform
No
Recommended
Baking
Conditions
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