ICS83905AMLFT View Datasheet(PDF) - Integrated Device Technology
Part Name
Description
MFG CO.
'ICS83905AMLFT' PDF : 19 Pages View PDF
ICS83905
LOW SKEW, 1:6 CRYSTAL-TO-LVCMOS/LVTTL FANOUT BUFFER
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
INPUTS:
LVCMOS CONTROL PINS
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
OUTPUTS:
LVCMOS OUTPUTS
All unused LVCMOS output can be left floating. There should be
no trace attached.
THERMAL RELEASE PATH
The expose metal pad provides heat transfer from the device to
the P.C. board. The expose metal pad is ground pad connected
to ground plane through thermal via. The exposed pad on the
device to the exposed metal pad on the PCB is contacted through
solder as shown in Figure 4. For further information, please refer
to the Application Note on Surface Mount Assembly of Amkor’s
Thermally /Electrically Enhance Leadframe Base Package, Amkor
Technology.
SOLDER M ASK
SIGNAL
TRACE
EXPOSED PAD
SOLDER
SIGNAL
TRACE
GROUND PLANE
THERMAL VIA
Expose Metal Pad
(GROUND PAD)
FIGURE 4. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
IDT™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
12
ICS83905AM REV. B JULY 9, 2007
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