IS24C32C View Datasheet(PDF) - Integrated Silicon Solution
Part Name
Description
MFG CO.
'IS24C32C' PDF : 20 Pages View PDF
IS24C32C
300-mil Plastic DIP
Package Code: N,P
N
E1
1
D
SEATING PLANE
S
S
B1
A
E
L
FOR
32-PIN ONLY
MILLIMETERS
Sym. Min.
Max.
N0.
Leads
8
A
3.68
4.57
A1
0.38
—
B
0.36
0.56
B1
1.14
1.52
B2
0.81
1.17
C
0.20
0.33
D
9.12
9.53
E
7.62
8.26
E1
6.20
6.60
eA
8.13
9.65
e
2.54 BSC
L
3.18
S
0.64
—
0.762
e
B
INCHES
Min.
Max.
C
A1
B2
eA
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should
be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within 0.004
inches at the seating plane.
0.145
0.180
0.015
—
0.014
0.022
0.045
0.060
0.032
0.046
0.008
0.013
0.359
0.375
0.300
0.325
0.244
0.260
0.320
0.380
0.100 BSC
0.125
0.025
—
0.030
16
Integrated Silicon Solution, Inc.
Rev. B
1/04/08
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