IS24C32C View Datasheet(PDF) - Integrated Silicon Solution

Part Name

Description

MFG CO.

IS24C32C

32K-bit 2-WIRE SERIAL CMOS EEPROM

Integrated Silicon Solution 

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IS24C32C

Plastic MSOP

Package Code: S

N

1

D

E1 E

SEATING PLANE

A

A1

L

e

α

C

B

Ref. Std.

Plastic MSOP (S)

JEDEC MO 187

No. Leads

8 (120 mil)

Inches

Symbol Min Max

A 0.038 0.043

A1 0.002 0.006

B 0.010 0.016

C 0.005 0.009

D 0.114 0.122

E 0.193BSC

E1 0.114 0.122

e 0.0256BSC

L — 0.022

α — 7°

Millimeters

Min Max

0.97 1.10

0.05 0.15

0.25 0.40

0.13 0.23

2.90 3.10

4.90 BSC

2.90 3.10

0.65 BSC

— 0.55

— 7°

Notes:

1. Controlling dimension: inches, unless

otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold

flash protrusions and should be measured

from the bottom of the package.

4. Formed leads shall be planar with respect to

one another within 0.004 inches at the

seating plane.

Integrated Silicon Solution, Inc.

19

RR1/e0v4./0B8

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