L6206 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6206' PDF : 23 Pages View PDF
L6206
Figure 18. Mounting the PowerSO package.
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes
Figure 19. PowerSO36 Junction-Ambient thermal resistance versus on-board copper area.
ºC / W
43
38
33
W ith o ut G ro u nd La yer
28
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
23
H o le s
On-Board Copper Area
18
13
1 2 3 4 5 6 7 8 9 10 1 1 1 2 13
sq. cm
Figure 20. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.
ºC / W
49
On-Board Copper Area
48
C o p pe r Are a is o n Bo tto m
S id e
47
46
C o p pe r Are a is o n To p S i de
45
44
43
42
41
40
39
1 2 3 4 5 6 7 8 9 10 11 12
s q. cm
Figure 21. SO24 Junction-Ambient thermal resistance versus on-board copper area.
ºC / W
68
On-Board Copper Area
66
64
62
60
C o pp er A re a is o n T op S id e
58
56
54
52
50
48
1 2 3 4 5 6 7 8 9 10 11 12
s q. cm
18/23
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