L6208Q View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6208Q' PDF : 34 Pages View PDF
Thermal management
8
Thermal management
L6208Q
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be delivered by the device in a safe operating condition. Therefore, it must
be considered very carefully. Besides the available space on the PCB, the right package
should be chosen considering the power dissipation. Heat sinking can be achieved using
copper on the PCB with proper area and thickness.
Table 7. Thermal data
Symbol
Parameter
Package
Typ. Unit
RthJA Thermal resistance junction-ambient
VFQFPN48(1)
17
°C/W
1. VFQFPN48 mounted on the EVAL6208Q rev 1 board (see EVAL6208Q databrief): four-layer FR4 PCB with
a dissipating copper surface of about 45 cm2 on each layer and 25 via holes below the IC.
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DocID018710 Rev 3
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