L6228Q View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6228Q' PDF : 32 Pages View PDF
L6228Q
7
Thermal management
Thermal management
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be delivered by the device in a safe operating condition. Therefore, it has to
be taken into account very carefully. Besides, the available space on the PCB, the right
package should be chosen considering the power dissipation. Heat sinking can be achieved
using copper on the PCB with proper area and thickness.
For instance, using a VFQFPN32L 5x5 package the typical Rth(JA) is about 42 °C/W when
mounted on a double-layer FR4 PCB with a dissipating copper surface of 0.5 cm2 on the top
side plus 6 cm2 ground layer connected through 18 via holes (9 below the IC).
Doc ID 14321 Rev 5
27/32
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