L6228Q View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6228Q' PDF : 32 Pages View PDF
Package mechanical data
8
Package mechanical data
L6228Q
Note:
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 8. VFQFPN32 5x5x1.0 pitch 0.50
Dim.
A
b
b1
D
D2
D3
E
E2
E3
e
L
ddd
Min.
0.80
0.18
0.165
4.85
3.00
1.10
4.85
4.20
0.60
0.30
mm
Typ.
0.85
0.25
0.175
5.00
3.10
1.20
5.00
4.30
0.70
0.50
0.40
Max.
0.95
0.30
0.185
5.15
3.20
1.30
5.15
4.40
0.80
0.50
0.08
VFQFPN stands for thermally enhanced very thin profile fine pitch quad flat package no
lead. Very thin profile: 0.80 < A < 1.00 mm.
Details of terminal 1 are optional but must be located on the top surface of the package by
using either a mold or marked features.
28/32
Doc ID 14321 Rev 5
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