LPC1777 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
LPC1777
NXP Semiconductors.
'LPC1777' PDF : 120 Pages View PDF
NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
Tj = Tamb + PD Rthj – a
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
Table 10. Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
Symbol
Parameter
Min
Typ
Max
Tj(max)
maximum junction
-
-
125
temperature
(1)
Unit
C
Table 11. Thermal resistance (LQFP packages)
Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Conditions
Thermal resistance in C/W ±15 %
LQFP208
LQFP144
ja
JEDEC (4.5 in 4 in)
0 m/s
27.4
31.5
1 m/s
25.7
28.1
2.5 m/s
24.4
26.2
Single-layer (4.5 in 3 in)
0 m/s
35.4
43.2
1 m/s
31.2
35.7
2.5 m/s
29.2
32.8
jc
-
8.8
7.8
jb
-
15.4
13.8
LPC178X_7X
Product data sheet
Table 12. Thermal resistance value (TFBGA packages)
Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Conditions
Thermal resistance in C/W ±15 %
TFBGA208
TFBGA180
ja
JEDEC (4.5 in 4 in)
0 m/s
41
45.5
1 m/s
35
38.3
2.5 m/s
31
33.8
8-layer (4.5 in 3 in)
0 m/s
34.9
38
1 m/s
30.9
33.5
2.5 m/s
28
29.8
jc
-
8.3
8.9
jb
-
13.6
12
All information provided in this document is subject to legal disclaimers.
Rev. 5.5 — 26 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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