Empfohlenes Lötpaddesign8) Seite 17
Recommended Solder Pad8) page 17
2.6 (0.102)
1.1 (0.043)
IR Reflow Löten
IR Reflow Soldering
3.3 (0.130)
3.3 (0.130)
0.4 (0.016)
LSY T676
Padgeometrie fĂĽr
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Empfohlenes Lötpaddesign8) Seite 17
Recommended Solder Pad8) page 17
Kathoden Markierung /
Cathode marking
Lötstoplack
Solder resist
Cu Fläche / 12 mm2 per pad
Cu-area
OHLPY439
Wellenlöten (TTW)
TTW Soldering
6.1 (0.240)
2.8 (0.110)
3.5 (0.138)
Padgeometrie fĂĽr
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
2012-04-20
2.8 (0.110) 0.5 (0.020)
7.5 (0.295)
Cu Fläche / > 12 mm2 per pad
Cu-area
Lötstoplack
Solder resist
12
OHAY0583