LSYT676 View Datasheet(PDF) - OSRAM GmbH
Part Name
Description
MFG CO.
'LSYT676' PDF : 17 Pages View PDF
LSY T676
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
300
ËšC
T 250
200
240 ËšC
217 ËšC
150
tS
100
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020D.01)
(acc. to J-STD-020D.01)
OHA04525
Tp 245 ËšC
tP
tL
50
25 ËšC
0
0
50
100
150
200
250
s 300
t
Profil-Charakteristik
Profile Feature
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum Recommendation Maximum
Ramp-up Rate to Preheat*)
25 °C to 150 °C
2
3
Time tS
TSmin to TSmax
Ramp-up Rate to Peak*)
TSmax to TP
tS
60
Liquidus Temperature
TL
Time above Liquidus temperature
tL
100
120
2
3
217
80
100
Peak Temperature
TP
245
260
Time within 5 °C of the specified peak tP
10
20
30
temperature TP - 5 K
Ramp-down Rate*
TP to 100 °C
Time
25 °C to TP
3
6
480
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
OHA04612
Einheit
Unit
K/s
s
K/s
°C
s
°C
s
K/s
s
2012-04-20
13
Share Link: 
