LTC4370IMSPBF View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC4370IMSPBF' PDF : 20 Pages View PDF
LTC4370
Applications Information
PCB Layout Considerations
Kelvin connection of the OUT pins to the sense resis-
tors is important for accurate current sharing. Place the
MOSFET as close as possible to the sense resistor. Keep the
traces to the MOSFET wide and short to minimize resistive
losses. The PCB traces associated with the power path
through the MOSFET should have low resistance. Thermal
management techniques such as sufficient drain cop-
per area or heat sinks should be considered for optimal
MOSFET power dissipation. See Figure 7.
It is also important to put CVCC, the bypass capacitor, as
close as possible between VCC and GND. Place C1 and
C2 near the CPO and VIN pins. The COMP pin may need
a guard ring to maintain low board leakage.
G
FROM
SUPPLY
W
A
S
VIA TO
GROUND
PLANE
CVCC
TRACK WIDTH
W: 0.03 PER AMPERE
ON 1oz Cu FOIL
MSOP-16
DRAWING IS NOT TO SCALE!
LTC4370
CURRENT FLOW
D
M1
DD-PAK
R1
R2
G
FROM
SUPPLY
W
D
M2
DD-PAK
B
S
CURRENT FLOW
4370 FO7
Figure 7. Recommended PCB Layout for M1, M2, CVCC, R1, R2
TO
LOAD
4370f
15
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