LTC6803-1/LTC6803-3
PACKAGE DESCRIPTION
G Package
44-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1754 Rev Ø)
1.25 ±0.12
12.50 – 13.10*
(.492 – .516)
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
7.8 – 8.2
5.3 – 5.7
7.40 – 8.20
(.291 – .323)
0.25 ±0.05
0.50
BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
5.00 – 5.60*
(.197 – .221)
1.65 – 1.85
(.065 – .073)
2.0
(.079)
MAX
PARTING
LINE
0° – 8°
0.10 – 0.25
(.004 – .010)
0.55 – 0.95**
(.022 – .037)
1.25
(.0492)
REF
NOTE:
1.DRAWING IS NOT A JEDEC OUTLINE
2. CONTROLLING DIMENSION: MILLIMETERS
3.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
4. DRAWING NOT TO SCALE
5. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE
0.50
(.01968)
BSC
0.20 – 0.30†
(.008 – .012)
TYP
SEATING
PLANE
0.05
(.002)
MIN
G44 SSOP 0607 REV Ø
*DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS,
BUT DO INCLUDE MOLD MISMATCH AND ARE MEASURED AT
THE PARTING LINE. MOLD FLASH SHALL NOT EXCEED .15mm PER SIDE
**LENGTH OF LEAD FOR SOLDERRING TO A SUBSTRATE
†THE MAXIMUM DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSIONS.
DAMBAR PROTRUSIONS DO NOT EXCEED 0.13mm PER SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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