LTM4604
APPLICATIONS INFORMATION
Table 2. 1.2V Output
DERATING CURVE
Figures 6, 8
Figures 6, 8
Figures 6, 8
Figures 7, 9
Figures 7, 9
Figures 7, 9
VIN (V)
3.3, 5
3.3, 5
3.3, 5
3.3, 5
3.3, 5
3.3, 5
POWER LOSS CURVE
Figure 4
Figure 4
Figure 4
Figure 4
Figure 4
Figure 4
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θJA (°C/W)
25
22.5
21
21
20
18
Table 3. 2.5V Output
DERATING CURVE
Figures 10, 12
Figures 10, 12
Figures 10, 12
Figures 11, 13
Figures 11, 13
Figures 11, 13
VIN (V)
3.3, 5
3.3, 5
3.3, 5
3.3, 5
3.3, 5
3.3, 5
POWER LOSS CURVE
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θJA (°C/W)
25
21
21
21
18
16
Table 4. Output Voltage Response Versus Component Matrix (Refer to Figure 17), 0A to 2A Load Step Typical Measured Values
CIN
VOUT (V) (CERAMIC)
CIN (Bulk)
COUT
DROOP PEAK-TO- RECOVERY LOAD STEP RFB
(CERAMIC) CCOMP VIN (V)
(mV) PEAK(mV)
(μs)
(A/μs)
(kΩ)
1.2
10μF 56μF Aluminum 100μF 6.3V None
2.5
21
43
10
2
10
1.2
10μF 56μF Aluminum 22μF ×4
None
3.3
23
45
10
2
10
1.2
10μF 56μF Aluminum 22μF ×4
None
5
24
46
10
2
10
1.5
10μF 56μF Aluminum 100μF 6.3V None
2.5
19
41
10
2
5.76
1.5
10μF 56μF Aluminum 22μF ×4
None
3.3
21
43
10
2
5.76
1.5
10μF 56μF Aluminum 22μF ×4
None
5
21
43
10
2
5.76
1.8
10μF 56μF Aluminum 100μF 6.3V None
2.5
25
50
10
2
4.02
1.8
10μF 56μF Aluminum 22μF ×3
None
3.3
30
60
10
2
4.02
1.8
10μF 56μF Aluminum 22μF ×3
None
5
30
60
10
2
4.02
2.5
10μF 56μF Aluminum 100μF 6.3V None
2.5
22
45
12
2
2.37
2.5
10μF 56μF Aluminum 22μF ×3
None
3.3
25
55
12
2
2.37
2.5
10μF 56μF Aluminum 22μF ×3
None
5
25
55
12
2
2.37
3.3
10μF 56μF Aluminum 100μF 6.3V None
2.5
22
50
15
2
1.62
3.3
10μF 56μF Aluminum 22μF ×3
None
3.3
25
56
15
2
1.62
3.3
10μF 56μF Aluminum 22μF ×3
None
5
25
56
15
2
1.62
4604f
14