LTM4604 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTM4604' PDF : 20 Pages View PDF
LTM4604
APPLICATIONS INFORMATION
Safety Considerations
The LTM4604 modules do not provide isolation from VIN to
VOUT. There is no internal fuse. If required, a slow blow fuse
with a rating twice the maximum input current needs to be
provided to protect each unit from catastrophic failure.
Layout Checklist/Example
The high integration of LTM4604 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
• Use large PCB copper areas for high current path,
including VIN, GND and VOUT. It helps to minimize the
PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capacitors
next to the VIN, GND and VOUT pins to minimize high
frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Do not put vias directly on the pads unless they are
capped.
• SW pads can be soldered to board to improve thermal
performance.
Figure14 gives a good example of the recommended
layout.
GND
VOUT
COUT
COUT
•••
COUT
••••
••
•••••
••
•••
VIN
•
•
••
•
•
•
••••
•••
••
•
•••
•
SW
•••••
CIN •
•
•
•
•
•
•
•
•
••
GND
•••••••••••
4604 F14
Figure 14. Recommended PCB Layout
VIN
2.375V TO 5.5V
CIN
10μF
6.3V
X5R OR X7R
OPEN-DRAIN
PULL UP
CSSEXT
0.01μF
VIN
PGOOD VOUT
LTM4604
COMP
FB
RUN/SS TRACK
GND
RFB
5.69k
0.5%
VOUT
1.5V
COUT 4A
22μF ×3
6.3V
X5R OR X7R
REFER TO
TABLE 4
4604 F15
Figure 15. Typical 2.375V to 5.5V Input, 1.5V at 4A Design
4604f
15
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