M25PX32 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M25PX32' PDF : 63 Pages View PDF
M25PX32
8
Initial delivery state
Initial delivery state
The device is delivered with the memory array erased: all bits are set to 1 (each byte
contains FFh). The Status Register contains 00h (all Status Register bits are 0).
9
Maximum rating
Stressing the device outside the ratings listed in Table 12: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only, and operation of the
device at these, or any other conditions outside those indicated in the operating sections of
this specification, is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 12. Absolute maximum ratings
Symbol
Parameter
Min.
Max. Unit
TSTG
TLEAD
Storage temperature
Lead temperature during soldering
–65
150
°C
see(1)
°C
VIO
Input and output voltage (with respect to ground)
–0.6 VCC+0.6 V
VCC
Supply voltage
–0.6
4.0
V
VPP
Fast Program/Erase voltage
–0.2
10.0
V
VESD Electrostatic discharge voltage (Human Body model)(2) –2000
2000
V
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
2. JEDEC Std JESD22-A114A (C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).
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