Maximum rating
4
Maximum rating
M41T81S
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Note:
Caution:
Table 6.
Sym
Absolute maximum ratings
Parameter
Value
Unit
TSTG
VCC
TSLD
VIO
IO
PD
Storage Temperature (VCC Off,
Oscillator Off)
SOIC
Supply Voltage
Lead Solder Temperature for 10
Seconds
Lead-free lead
finish(1)
Standard (SnPb)
lead finish(2,3)
Input or Output Voltages
Output Current
Power Dissipation
–55 to 125
°C
–0.3 to 7
V
260
°C
240
°C
–0.3 to Vcc+0.3 V
20
mA
1
W
For SO8 package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C
(total thermal budget not to exceed 245°C for greater than 30 seconds).
For SO8 package, standard (SnPb) lead finish: Reflow at peak temperature of 240°C (total
thermal budget not to exceed 180°C for between 90 to 150 seconds).
The SOX18 package has Lead-free (Pb-free) lead finish, but cannot be exposed to peak
reflow temperature in excess of 240°C (use same reflow profile as standard (SnPb) lead
finish).
Negative undershoots below –0.3 volts are not allowed on any pin while in the Battery Back-
up Mode
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