M41T81S View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M41T81S' PDF : 31 Pages View PDF
M41T81S
6
Package mechanical data
Package mechanical data
Note:
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 18. SO8 – 8-lead plastic small package outline
h x 45˚
A2
b
e
A
ccc
D
8
E1 E
1
A1
c
0.25 mm
GAUGE PLANE
k
L
L1
SO-A
Drawing is not to scale.
Table 14. SO8 – 8-lead plastic small outline (150 mils body width), package
mechanical data
Symb
Typ
A
A1
A2
b
c
ccc
D
4.90
E
6.00
E1
3.90
e
1.27
h
k
L
L1
1.04
mm
inches
Min
Max
Typ
Min
Max
1.75
0.069
0.10
0.25
0.004
0.010
1.25
0.049
0.28
0.48
0.011
0.019
0.17
0.23
0.007
0.009
0.10
0.004
4.80
5.00
0.193
0.189
0.197
5.80
6.20
0.236
0.228
0.244
3.80
4.00
0.154
0.150
0.157
0.050
0.25
0.50
0.010
0.020
0°
8°
0°
8°
0.40
0.127
0.016
0.050
0.041
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