M7010R View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M7010R' PDF : 67 Pages View PDF
M7010R
PACKAGE MECHANICAL INFORMATION
Figure 46. PBGA-Z00 – 272-ball Plastic Ball Grid Array Package Outline
D2
PIN #1
E2
4.00*45˚ (4x)
Note: Drawing is not to scale.
0.56 REF.
A1
C
1.17 REF.
19 17 15 13 11 9
20 18 16 14 12 10
8
7
6
5
4
3
2
1
30˚ TYP.
e
E E1
A2
ddd C
B
e
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
D1 b
D
0.220 (3x)
0.300 C A S B S
0.100 C b (272x)
PBGA-Z00
Table 41. PBGA-Z00 – 272-ball Plastic Ball Grid Array Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
Typ
Min
Max
A(4)
27.00
26.80
27.20(1)
1.102
1.094
1.110(1)
A1(2,3)
0.60
0.50
0.70
0.024
0.020
0.029
A2
1.63
1.90
0.067
0.078
B(4)
27.00
26.80
27.20
1.102
1.094
1.110
b
0.75
0.60
0.90
0.031
0.024
0.037
D
27.00
26.80
27.20
1.102
1.094
1.110
D1
24.13
0.985
D2
24.00
0.980
E
27.00
26.80
27.20
1.102
1.094
1.110
E1
24.13
0.985
E2
24.00
0.980
e
1.27
0.052
ddd
0.20
0.008
Note: 1. Maximum mounted height is 2.45mm based on a 0.65mm ball pad diameter. Solder paste is 0.15mm thickness and 0.65mm in di-
ameter.
2. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink, or metallized markings, or other feature
of package body or integral heatslug.
3. A distinguished feature is allowable on the bottom surface of the package to identify the terminal A1 corner.
4. Exact shape of each corner is optional.
65/67
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