M95320-DRE View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M95320-DRE' PDF : 41 Pages View PDF
M95320-DRE
Package information
Table 15. TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch,
package mechanical data (continued)
Symbol
Min.
millimeters
Typ.
Max.
Min.
inches(1)
Typ.
Max.
E
6.200
6.400
6.600
0.2441
E1
4.300
4.400
4.500
0.1693
L
0.450
0.600
0.750
0.0177
L1
-
1.000
-
-
α
0°
-
8°
0°
1. Values in inches are converted from mm and rounded to four decimal digits.
0.2520
0.1732
0.0236
0.0394
-
0.2598
0.1772
0.0295
-
8°
9.3
WFDFPN8 package information
Figure 23. WFDFPN8 (MLP8) – 8-lead very thin fine pitch dual flat package no lead
2 x 3 mm, 0.5 mm, package outline
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1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating
(not connected) in the end application.
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