MAS9116ASBA View Datasheet(PDF) - Micro Analog systems
Part Name
Description
MFG CO.
'MAS9116ASBA' PDF : 18 Pages View PDF
SOLDERING INFORMATION
DA9116.005
22 November, 2005
N For Lead-Free / Green QFN 4mm x 5mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
Solder plate 7.62 - 25.4 µm, material Matte Tin
EMBOSSED TAPE SPECIFICATIONS, QFN 4x5 PACKAGE
P2
PO
P1
D0
W
R 0.5 typ
A0
User Direction of Feed
X
T
E
F
B0
X
K0
Dimension
Min/Max
Unit
Ao
4.30 ±0.10
mm
Bo
5.30 ±0.10
mm
Do
1.50 +0.1/-0.0
mm
E
1.75
mm
F
5.50 ±0.5
mm
Ko
1.10 ±0.10
mm
Po
4.0
mm
P1
8.0 ±0.10
mm
P2
2.0 ±0.05
mm
T
0.3 ±0.05
mm
W
12.00 ±0.3
mm
All dimensions in millimeters
16 (18)
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