ML7029 View Datasheet(PDF) - LAPIS Semiconductor Co., Ltd.
Part Name
Description
MFG CO.
'ML7029' PDF : 29 Pages View PDF
PACKAGE DIMENSIONS
SSOP30-P-56-0.65-K
Mirror finish
FEDL7029-04
ML7029
(Unit: mm)
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5μm)
0.19 TYP.
5/Dec. 5, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions (reflow
method, temperature and times).
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