ML9042 View Datasheet(PDF) - LAPIS Semiconductor Co., Ltd.
Part Name
Description
MFG CO.
'ML9042' PDF : 58 Pages View PDF
LAPIS Semiconductor
FEDL9042-01
ML9042-xx
ML9042-xx CVWA GOLD BUMP SPECIFICATION (LOW HARDNESS)
Gold Bump Specification
Symbol
A
B
C
D
E
F
G
H
I
J
K
Parameter
Bump Pitch (I/O Section: Pitch Direction)
Bump Size (I/O Section: Pitch Direction)
Bump Size (I/O Section: Depth Direction)
Bump-to-Bump Distance (I/O Section: Pitch Direction)
Bump Size (L-mark Section: Length)
Bump Size (L-mark Section: Width)
Sliding of Total Bump Pitches
Bump Height
Bump Height Dispersion Inside Chip (Range)
Bump Edge Height
Shear Strength (g)
Bump Hardness (Hv: 25 g load)
Top View and Cross Section View
(Unit: m)
MIN
TYP
MAX
70
—
—
40
44
48
96
100
104
22
26
30
76
80
84
26
30
34
—
—
2
10
15
20
—
—
4
—
—
5
27
—
—
30
—
80
Wafer Thickness; 625 20 m
Chip Size; 7.80 mm 1.80 mm
A
B
D
[I/O Section]
[L-Alignment Mark]
[Cross Section View]
56/58
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