MT48LC128M4A2P-75C View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT48LC128M4A2P-75C' PDF : 68 Pages View PDF
512Mb: x4, x8, x16 SDRAM
Electrical Specifications
Table 11: Temperature Limits
Parameter
Symbol Min
Max
Units Notes
Operating case temperature:
Commercial
Industrial
Junction temperature:
Commercial
Industrial
Ambient temperature:
Commercial
Industrial
Peak reflow temperature
TC
0
80
–40
90
TJ
0
85
–40
95
TA
0
70
–40
85
TPEAK
–
260
°C
1, 2, 3, 4
°C
3
°C
3, 5
°C
Notes:
1. MAX operating case temperature, TC, is measured in the center of the package on the top
side of the device, as shown on page 47.
2. Device functionality is not guaranteed if the device exceeds maximum TC during operation.
3. Both temperature specifications must be satisfied.
4. The case temperature should be measured by gluing a thermocouple to the top center of
the component. This should be done with a 1mm bead of conductive epoxy, as defined by
the JEDEC EIA/JESD51 standards. Care should be taken to ensure the thermocouple bead is
touching the case.
5. Operating ambient temperature surrounding the package.
Table 12: Summary of Thermal Impedance
Die Size
(mm2)
94
Package
TSOP
Number of
Leads
54
Test
Board
2-layer
4-layer
θJA
(°C/W)
0m/s
62.6
39.2
θJMA
(°C/W)
1m/s
48.4
32.3
θJMA
(°C/W)
2m/s
44.2
30.6
θJB
(°C/W)
19.2
19.3
θJC
(°C/W)
6.7
Figure 32: Example Temperature Test Point Location, 54-Pin TSOP: Top View
Test point
11.11mm
22.22mm
10.16mm
5.08mm
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
43
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