MT48V4M32LFFF View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT48V4M32LFFF' PDF : 61 Pages View PDF
54-BALL VFBGA (8mm x 9mm)
0.70 ±0.075
ADVANCE
128Mb: x16, x32
MOBILE SDRAM
SEATING PLANE
C
0.08 C
54X ∅0.35
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
BALL A9
6.40
3.20 ±0.05
6.40
0.80
TYP
BALL A1 ID
BALL A1
0.80
TYP
9.00 ±0.10
CL
4.50 ±0.05
3.20 ±0.05
CL
4.00 ±0.05
8.00 ±0.10
1.0 MAX
BALL A1 ID
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
NOTE: 1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
128Mb: x16, x32 Mobile SDRAM
MobileY95W_3V_F.p65 – Rev. F; Pub. 9/02
59
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
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