PCA9512ADP View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCA9512ADP' PDF : 23 Pages View PDF
NXP Semiconductors
PCA9512A; PCA9512B
Level shifting hot swappable I2C-bus and SMBus bus buffer
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Soldering: PCB footprints
5.50
0.60 (8×)
1.30
4.00 6.60 7.00
1.27 (6×)
solder lands
occupied area
placement accuracy ± 0.25
Dimensions in mm
Fig 19. PCB footprint for SOT96-1 (SO8); reflow soldering
sot096-1_fr
PCA9512A_PCA9512B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 1 March 2013
© NXP B.V. 2013. All rights reserved.
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