NXP Semiconductors
PCA9512A; PCA9512B
Level shifting hot swappable I2C-bus and SMBus bus buffer
0.60 (6×)
1.20 (2×)
0.3 (2×)
enlarged solder land
1.30
4.00 6.60 7.00
1.27 (6×)
5.50
board direction
solder lands
occupied area
solder resist
placement accurracy ± 0.25
Dimensions in mm
Fig 20. PCB footprint for SOT96-1 (SO8); wave soldering
0.725
3.600
2.950
0.125
0.125
sot096-1_fw
5.750 3.600
3.200 5.500
1.150
0.600
0.650
0.450
solder lands
occupied area
Dimensions in mm
Fig 21. PCB footprint for SOT505-1 (TSSOP8); reflow soldering
sot505-1_fr
PCA9512A_PCA9512B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 1 March 2013
© NXP B.V. 2013. All rights reserved.
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