NXP Semiconductors
PCF2123
SPI Real time clock/calendar
11. Limiting values
Table 43. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VDD
supply voltage
IDD
supply current
VI
input voltage
VO
output voltage
II
input current
IO
output current
[1] −0.5
−50
[1] −0.5
[1] −0.5
−10
−10
Ptot
total power dissipation
-
VESD
electrostatic discharge
HBM
[2] -
voltage
Ilu
Tstg
Tamb
latch-up current
storage temperature
ambient temperature
operating device
[3] -
[4] −65
−40
Max Unit
+6.5 V
+50 mA
+6.5 V
+6.5 V
+10 mA
+10 mA
300 mW
±3000 V
200 mA
+150 °C
+85 °C
[1] With respect to VSS.
[2] Pass level; Human Body Model (HBM) according to Ref. 8 “JESD22-A114”
[3] Pass level; latch-up testing, according to Ref. 9 “JESD78” at maximum ambient temperature (Tamb(max)).
[4] According to the NXP store and transport requirements (see Ref. 11 “NX3-00092”) the devices have to be
stored at a temperature of +8 °C to +45 °C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 27 April 2011
© NXP B.V. 2011. All rights reserved.
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