NXP Semiconductors
28. Figures
Fig 1. Block diagram of PCF2123 . . . . . . . . . . . . . . . . . .3
Fig 2. Pin configuration for HVQFN16 (PCF2123BS/1) . .4
Fig 3. Pin configuration for TSSOP14 (PCF2123TS/1) . .4
Fig 4. Pin configuration for PCF2123Ux (bare die) . . . . .4
Fig 5. IDD with respect to quartz RS . . . . . . . . . . . . . . . . .7
Fig 6. IDD with respect to timer clock selection . . . . . . . .7
Fig 7. Software reset command . . . . . . . . . . . . . . . . . . .10
Fig 8. OS set by failing VDD . . . . . . . . . . . . . . . . . . . . . .12
Fig 9. OS flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Fig 10. Data flow of the time function. . . . . . . . . . . . . . . .15
Fig 11. Access time for read/write operations . . . . . . . . .16
Fig 12. Alarm function block diagram. . . . . . . . . . . . . . . .18
Fig 13. Alarm flag timing . . . . . . . . . . . . . . . . . . . . . . . . .19
Fig 14. INT example for MI and SI . . . . . . . . . . . . . . . . . .21
Fig 15. General countdown timer behavior . . . . . . . . . . .22
Fig 16. Interrupt scheme . . . . . . . . . . . . . . . . . . . . . . . . .25
Fig 17. Example of shortening the INT pulse
by clearing the MSF flag . . . . . . . . . . . . . . . . . . .26
Fig 18. Example of shortening the INT pulse
by clearing the TF flag . . . . . . . . . . . . . . . . . . . . .27
Fig 19. AF timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Fig 20. Offset calibration calculation workflow . . . . . . . . .31
Fig 21. STOP bit functional diagram . . . . . . . . . . . . . . . .33
Fig 22. STOP bit release timing . . . . . . . . . . . . . . . . . . . .33
Fig 23. SDI, SDO configurations . . . . . . . . . . . . . . . . . . .35
Fig 24. Data transfer overview . . . . . . . . . . . . . . . . . . . . .35
Fig 25. Serial bus write example . . . . . . . . . . . . . . . . . . .36
Fig 26. Serial bus read example . . . . . . . . . . . . . . . . . . .36
Fig 27. Interface watchdog timer . . . . . . . . . . . . . . . . . . .37
Fig 28. Device diode protection diagram of PCF2123 . . .38
Fig 29. SPI-bus timing . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Fig 30. Typical application diagram . . . . . . . . . . . . . . . . .44
Fig 31. Package outline SOT758-1 (HVQFN16) of
PCF2123BS/1 . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Fig 32. Package outline SOT402-1 (TSSOP14) of
PCF2123TS/1 . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Fig 33. Bare die outline PCF2123U/10 of PCF2123U/5GA/1
and PCF2123U/10AA/1
(for dimensions see Table 47) . . . . . . . . . . . . . . .47
Fig 34. Bare die outline PCF2123U/12 of
PCF2123U/12AA/1 and PCF2123U/12HA/1
(for dimensions see Table 48) . . . . . . . . . . . . . . .48
Fig 35. Alignment mark . . . . . . . . . . . . . . . . . . . . . . . . . .50
Fig 36. PCF2123Ux wafer information. . . . . . . . . . . . . . .51
Fig 37. Film Frame Carrier (FFC) for 6 inch wafer
(PCF2123U/10AA/1) . . . . . . . . . . . . . . . . . . . . . .52
Fig 38. Film Frame Carrier (FFC) for 8 inch wafer
(PCF2123U/12AA/1 and PCF2123U/12HA/1) . . .52
Fig 39. Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Fig 40. Footprint information for reflow soldering of
SOT758-1 (HVQFN16) package
of PCF2123BS/1 . . . . . . . . . . . . . . . . . . . . . . . . .56
Fig 41. Footprint information for reflow soldering of
SOT402-1 (TSSOP14) package
of PCF2123TS/1 . . . . . . . . . . . . . . . . . . . . . . . . .57
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 15 July 2013
PCF2123
SPI Real time clock/calendar
© NXP B.V. 2013. All rights reserved.
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