PCF8533 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF8533' PDF : 45 Pages View PDF
NXP Semiconductors
PCF8533
Universal LCD driver for low multiplex rates
14. Bare die description
14.1 Gold bump hardness
Table 20. Gold bump hardness
Type number
Min
PCF8533U/2/F2
60
PCF8533U/2DA/2
35
[1] Pressure of diamond head: 10 g to 50 g.
14.2 Alignment marks
Max
120
80
Unit[1]
HV
HV
REF
C2
REF
C1
REF
F
mgl756
The positions of the alignment marks are shown in Figure 2 and Figure 25.
Fig 24. Alignment marks of PCF8533
Table 21.
Symbol
C1
C2
F
Alignment mark locations
X (μm)
2 300.5
−2 320.2
−2 208.3
Y (μm)
55.0
107.0
−165.4
14.3 Bump locations
PCF8533_4
Product data sheet
Table 22. Bump locations
All x/y coordinates represent the position of the centre of each bump with respect to the center
(x/y = 0) of the chip; see Figure 25.
Symbol Bump X (μm) Y (μm)
Description
SDAACK 1
−1079.20 −594.40
[1] I2C-bus acknowledge output
SDA
2
−839.20 −594.40
[1] I2C-bus serial data input
SDA
3
−759.20 −594.40
[1]
SCL
4
−599.20 −594.40
I2C-bus serial clock input
SCL
5
−519.20 −594.40
CLK
6
−414.80 −594.40
clock input/output
VDD
7
SYNC 8
−284.80 −594.40
4.20
−594.40
supply voltage
cascade synchronization input/output
OSC
9
119.20 −594.40
oscillator select
All information provided in this document is subject to legal disclaimers.
Rev. 04 — 5 March 2010
© NXP B.V. 2010. All rights reserved.
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