PI3033B View Datasheet(PDF) - AMI Semiconductor
Part Name
Description
MFG CO.
'PI3033B' PDF : 13 Pages View PDF
Preliminary PI3033B datasheet
Bonding Pad Outputs Locations and Die Dimensions
Figure 2 shows image sensors die dimension and the bonding pad locations for PI3033B Sensor Chip. The location is
referenced to the lower left corner of the die. Note RSTLV, bias, pad is not used.
Figure 2. Bonding Pad and Chip Layout:
Page 3 of 13 Date: 03/18/05
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