PI3033B View Datasheet(PDF) - AMI Semiconductor
Part Name
Description
MFG CO.
'PI3033B' PDF : 13 Pages View PDF
Preliminary PI3033B datasheet
Wafer Scribe Lines Bordering The Die
Figure 3 shows the wafer scribe lines bordering the PI3033B Sensor Chip. The wafer thickness is 350µcrons.
Figure 3. Wafer Scribe Lines
Page 4 of 13 Date: 03/18/05
Share Link: 
