QL6325E Eclipse-E Data Sheet Rev. F
Packaging Information
The Eclipse-E product family packaging information is presented in Table 33.
NOTE: Military temperature range plastic packages will be added as follow on products to the commercial
and industrial products.
Table 33: Packaging Options
Device Information
Package Definitionsa
QL6325E
Pin/Ball
Pitch
208 PQFP
0.50 mm
280 LFBGA
0.80 mm
484 BGA
1.0 mm
a. PQFP = Plastic Quad Flat Pack
BGA = Ball Grid Array
LFBGA = Low Profile Fine Pitch Ball Grid Array
Ordering Information
QuickLogic device
Eclipse-E device
part number
Speed Grade
6 = Fast
7 = Faster
8 = Fastest
QL 6325E - 6 PQ208 C
Operating Range
C = Commercial
I = Industrial
M = Military
Package Code
PQ208 (PQN208)* = 208-pin PQFP
PT280 (PTN280)* = 280-pin LFBGA (0.8 mm)
PS484 = 484-pin BGA (1.0 mm)
* Lead-free packaging is available, contact QuickLogic regarding availability (see Contact Information).
© 2005 QuickLogic Corporation
www.quicklogic.com
•
•••
••
55