Numonyx™ Embedded Flash Memory (J3 v D, Monolithic)
Table 1: 56-Lead TSOP Dimension Table
Parameter
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Symbol
N
q
Y
Z
Millimeters
Min
0°
0.150
Nom
56
3°
0.250
Max
5°
0.100
0.350
Min
0°
0.006
Inches
Nom
56
3°
0.010
3.2
Easy BGA Package, 32-, 64-, 128-, and 256-Mbit
Max
5°
0.004
0.014
Figure 4: Easy BGA Mechanical Specifications
Ball A1
Corner
D
Ball A1
Corner
S1
12345678
A
B
C
D
E
F
G
H
87654321
A
B
C
D
E
E
F
G
H
S2
e
Top View - Plastic Backside
Complete Ink Mark Not Shown
A1
A2
b
Bottom View - Ball Side Up
A
Seating
Y
Plane
Table 2: Easy BGA Package Dimensions Table (Sheet 1 of 2)
Parameter
Symb
ol
Min
Package Height (32, 64, 128, 256 Mbit)
A
Ball Height
A1
Package Body Thickness (32, 64, 128, 256 Mbit) A2
Ball (Lead) Width
b
0.250
0.330
Millimeters
Nom
Max
1.200
0.780
0.430
0.530
Inches
Note
s
Min
Nom
Max
0.0098
0.0130
0.0307
0.0169
0.0472
0.0209
December 2007
316577-06
Datasheet
13