RFD10P03LSM View Datasheet(PDF) - Harris Semiconductor
Part Name
Description
MFG CO.
'RFD10P03LSM' PDF : 12 Pages View PDF
RFD10P03L, RFD10P03LSM, RFP10P03L
TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
A
ØP
E
Q
H1
D
E1
L1
L
60o
D1
b1
b
123
e
e1
45o
c
J1
LEAD NO. 1
LEAD NO. 2
LEAD NO. 3
TERM. 4
- GATE
- DRAIN
- SOURCE
- DRAIN
A1
TERM. 4
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.170
0.180
4.32
4.57
-
A1
0.048
0.052
1.22
1.32
-
b
0.030
0.034
0.77
0.86
3, 4
b1
0.045
0.055
1.15
1.39
2, 3
c
0.014
0.019
0.36
0.48
2, 3, 4
D
0.590
0.610 14.99
15.49
-
D1
-
0.160
-
4.06
-
E
0.395
0.410 10.04
10.41
-
E1
-
0.030
-
0.76
-
e
0.100 TYP
2.54 TYP
5
e1
0.200 BSC
5.08 BSC
5
H1
0.235
0.255
5.97
6.47
-
J1
0.100
0.110
2.54
2.79
6
L
0.530
0.550 13.47
13.97
-
L1
0.130
0.150
3.31
3.81
2
ØP
0.149
0.153
3.79
3.88
-
Q
0.102
0.112
2.60
2.84
-
NOTES:
1. These dimensions are within allowable dimensions of Rev. J of
JEDEC TO-220AB outline dated 3-24-87.
2. Lead dimension and finish uncontrolled in L1.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder coating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 1 dated 1-93.
9
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