SST29EE010-70-4C-WN View Datasheet(PDF) - Silicon Storage Technology
Part Name
Description
MFG CO.
'SST29EE010-70-4C-WN' PDF : 30 Pages View PDF
1 Mbit Page-Write EEPROM
SST29EE010 / SST29VE010
Pin # 1 Identifier
Data Sheet
1.05
0.95
0.50
BSC
8.10
0.27
7.90
0.17
12.50
12.30
0.70
0.50
14.20
13.80
1.20
max.
0.15
0.05
DETAIL
Note:
0.70
0.50
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
1mm
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
0˚- 5˚
32-tsop-WH-7
©2005 Silicon Storage Technology, Inc.
27
S71061-11-000
9/05
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