SST29EE010-70-4C-WN View Datasheet(PDF) - Silicon Storage Technology
Part Name
Description
MFG CO.
'SST29EE010-70-4C-WN' PDF : 30 Pages View PDF
Data Sheet
Pin # 1 Identifier
1 Mbit Page-Write EEPROM
SST29EE010 / SST29VE010
1.05
0.95
0.50
BSC
8.10
0.27
7.90
0.17
18.50
18.30
0.70
0.50
20.20
19.80
1.20
max.
Note:
1.Complies with JEDEC publication 95 MO-142 BD dimensions,
although some dimensions may be more stringent.
2.All linear dimensions are in millimeters (max/min).
3.Coplanarity: 0.1 mm
4.Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 20MM
SST PACKAGE CODE: EH
0.15
0.05
DETAIL
0˚- 5˚
0.70
0.50
1mm
32-tsop-EH-7
©2005 Silicon Storage Technology, Inc.
28
S71061-11-000
9/05
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