ST1S10 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'ST1S10' PDF : 26 Pages View PDF
ST1S10
Figure 7. PCB layout suggestion
Layout considerations
Common ground node
for power ground
Power Ground
IIN
6.1
Thermal considerations
The leadframe die pad, of ST1S10, is exposed at the bottom of the package and must be
soldered directly to a properly designed thermal pad on the PCB, the addition of thermal
vias from the thermal pad to an internal ground plane will help increase power dissipation.
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