ST7FLITE29 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
ST7FLITE29
STMicroelectronics
'ST7FLITE29' PDF : 133 Pages View PDF
ST7LITE2
14.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACKTM.
■ ECOPACKTM packages are qualified according
to the JEDEC STD-020C compliant soldering
profile.
■ Detailed information on the STMicroelectronics
ECOPACKTM transition program is available on
www.st.com/stonline/leadfree/, with specific
technical Application notes covering the main
technical aspects related to lead-free
conversion (AN2033, AN2034, AN2035,
AN2036).
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACKTM TQFP, SDIP and SO packages
are fully compatible with Lead (Pb) containing
soldering process (see application note AN2034)
– TQFP, SDIP and SO Pb-packages are compati-
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Table 22. Soldering Compatibility (wave and reflow soldering process)
Package
Plating material devices
Pb solder paste
Pb-free solder paste
SDIP & PDIP
Sn (pure Tin)
Yes
Yes *
TQFP and SO
NiPdAu (Nickel-palladium-Gold)
Yes
Yes *
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
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