STCN75DS2F View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STCN75DS2F' PDF : 35 Pages View PDF
Maximum ratings
5
Maximum ratings
STCN75
Stressing the device above the ratings listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 10. Absolute maximum ratings
Symbol
Parameter
Value
TSTG
TSLD(1)
Storage temperature (VCC off, VBAT off)
Lead solder temperature for 10 seconds
–60 to 150
260
VIO
Input or output voltage
VCC +0.5
VDD
Supply voltage
7.0
VOUT
Output voltage
VDD + 0.5
IO
Output current
10
PD
Power dissipation
320
θJA
Thermal resistance
216.3
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Unit
°C
°C
V
V
V
mA
mW
°C/W
26/36
Doc ID 13307 Rev 9
Share Link: 
