STPS2L60-Y View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STPS2L60-Y' PDF : 7 Pages View PDF
STPS2L60-Y
Characteristics
Figure 1. Average forward power dissipation Figure 2. Average forward current versus
versus average forward current
ambient temperature (δ = 0.5)
PF(AV)(W)
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0 0.2 0.4
δ = 0.05
δ = 0.1
δ = 0.2
IF(AV)(A)
0.6 0.8 1.0 1.2 1.4
δ = 0.5
δ=1
T
δ=tp/T
tp
1.6 1.8 2.0 2.2 2.4
IF(AV)(A)
2.2
2.0
Rth(j-a)=Rth(j-I)
1.8
1.6
1.4
1.2
Rth(j-a)=100°C/W
1.0
0.8
0.6
T
0.4
0.2
δ=tp/T
tp
0.0
Tamb(°C)
0
25
50
75
100
125
150
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4.
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(1µs)
1
0.1
0.01
0.001
0.01
0.1
tp(µs)
1
10
PARM(Tj)
PARM(25°C)
1.2
1
0.8
0.6
0.4
0.2
0
100
1000
25
50
Tj(°C)
75
100
125
150
Figure 5.
Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
10
9
8
7
6
5
4
3
2
IM
1
0
1.E-03
t
δ=0.5
1.E-02
t(s)
1.E-01
Ta=25°C
Ta=75°C
Ta=125°C
1.E+00
Figure 6.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-l)/Rth(j-l)
1.0
Epoxy printed circuit board FR4, copper thickness: 35 µm
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-04
1.E-03
tp(s)
1.E-02
1.E-01
1.E+00
Doc ID 018927 Rev 1
3/7
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