STPS3045C View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STPS3045C' PDF : 12 Pages View PDF
STPS3045C
Characteristics
Figure 11. Forward voltage drop versus forward
current (maximum values, per diode)
IFM(A)
1000
100
10
Tj=125°C
(typical values)
Tj=125°C
(maximum values)
Tj=25°C
(maximum values)
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Figure 12. Thermal resistance junction to
ambient versus copper surface under tab
Rth(j-a)(°C/W)
80
Epoxy printed circuit board, copper thickness: 35 µm, D2PAK
70
60
50
40
30
20
10
0
0
S(cm²)
5
10
15
20
25
30
35
40
Doc ID 3510 Rev 8
5/12
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