STTH200L04TV1 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STTH200L04TV1' PDF : 8 Pages View PDF
Package information
2
Package information
STTH200L04TV1
● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6. ISOTOP dimensions
E
G2
C
A A1
C2
E2
F1 F
P1
DS
B
G D1
ØP
G1
E1
Dimensions
Ref.
Millimeters
Inches
Min. Max. Min. Max.
A 11.80 12.20 0.465 0.480
A1
8.90
9.10 0.350 0.358
B
7.8
8.20 0.307 0.323
C
0.75
0.85 0.030 0.033
C2
1.95
2.05 0.077 0.081
D 37.80 38.20 1.488 1.504
D1 31.50 31.70 1.240 1.248
E 25.15 25.50 0.990 1.004
E1 23.85 24.15 0.939 0.951
E2
24.80 typ.
0.976 typ.
G 14.90 15.10 0.587 0.594
G1 12.60 12.80 0.496 0.504
G2
3.50
4.30 0.138 0.169
F
4.10
4.30 0.161 0.169
F1
4.60
5.00 0.181 0.197
P
4.00
4.30 0.157 0.69
P1
4.00
4.40 0.157 0.173
S 30.10 30.30 1.185 1.193
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Doc ID 12827 Rev 2
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